Menu
Menu
Your Cart

GIGABYTE B850M DS3H ICE – AM5 Socket & DDR5 8200 MT/s — 2.5GbE LAN, Q-Flash Plus & White ICE Aesthetic Design

GIGABYTE B850M DS3H ICE – AM5 Socket & DDR5 8200 MT/s — 2.5GbE LAN, Q-Flash Plus & White ICE Aesthetic Design
  • Stock: In Stock
  • Model: B850M DS3H ICE Micro ATX Motherboard
  • MPN: B850M DS3H ICE
views 1406
7,950 EGP
Shiping Information
Nationwide shipping across Egypt. Fees confirmed by phone before shipping.

Description

Model Name
GIGABYTE B850M DS3H ICE Micro ATX Motherboard
Brand
GIGABYTE

CPU & Chipset

  • CPU Socket: AMD Socket AM5
  • Supported Processors: AMD Ryzen™ 9000 / 8000 / 7000 Series Desktop Processors
  • Chipset: AMD B850

Memory

  • Memory Type: DDR5
  • Memory Slots: 4 × DDR5 DIMM sockets (Dual-channel architecture)
  • Maximum Capacity: 256 GB (64 GB per DIMM)
  • Supported Speeds: DDR5 8200(OC) / 8000(OC) / 7800(OC) / 7600(OC) / 7200(OC) / 7000(OC) / 6800(OC) / 6600(OC) / 6400(OC) / 6200(OC) / 6000(OC) / 5600(OC) / 5200 / 4800 / 4400 MT/s
  • Supported Modules: Non-ECC Un-buffered DIMM, AMD EXPO™, Intel® XMP

Onboard Graphics & Display Outputs

  • Integrated Graphics: AMD Radeon™ Graphics (CPU-dependent)
  • Display Outputs:
    • 1 × HDMI 2.1 port: Up to 4096 × 2160 @ 60 Hz, HDCP 2.3, HDR support
    • 2 × DisplayPort 1.4 ports: Up to 3840 × 2160 @ 144 Hz
  • Multi-Display Support: Up to triple-display simultaneously

Audio & LAN

  • Audio CODEC: Realtek® High Definition Audio CODEC
  • Audio Channels: 2/4/5.1/7.1-channel configurable via software
  • LAN: Realtek® 2.5GbE LAN chip (2.5 / 1 / 0.1 Gbps)

Expansion Slots

  • PCIe x16 (CPU): 1 × PCI Express x16 slot (PCIEX16)
    • Ryzen 9000/7000 Series: PCIe 5.0 x16 mode
    • Ryzen 8000 Series (Phoenix 1): PCIe 4.0 x8 mode
    • Ryzen 8000 Series (Phoenix 2): PCIe 4.0 x4 mode
  • PCIe x16 (Chipset): 1 × PCI Express x16 slot (PCIEX4) running at PCIe 3.0 x4

Storage Interfaces

  • M.2 Slots: 2 × M.2 Socket 3 (M key)
    • M2A_CPU (CPU lanes): Supports PCIe 5.0 x4/x2 (Ryzen 9000/7000) or PCIe 4.0 (Ryzen 8000). Types 25110/22110/2580/2280.
    • M2B_CPU (CPU lanes): Supports PCIe 4.0 x4/x2. Types 22110/2280.
  • SATA Ports: 4 × SATA 6Gb/s connectors
  • RAID Support: RAID 0/1/5/10 for NVMe (RAID 5 requires Ryzen 9000); RAID 0/1/10 for SATA

USB Connectivity

  • Back Panel:
    • 1 × USB Type-C® (USB 3.2 Gen 2, 10 Gbps)
    • 1 × USB 3.2 Gen 2 Type-A (10 Gbps, red)
    • 2 × USB 3.2 Gen 1 Type-A (5 Gbps)
    • 4 × USB 2.0/1.1 Type-A
  • Internal Headers:
    • 1 × USB Type-C® header (USB 3.2 Gen 2x2, 20 Gbps)
    • 1 × USB 3.2 Gen 1 header (2 ports)
    • 2 × USB 2.0/1.1 headers (4 ports)

Internal I/O Connectors

  • 1 × 24-pin ATX main power
  • 1 × 8-pin ATX 12V CPU power
  • 1 × CPU fan header, 1 × CPU fan/water cooling pump header
  • 1 × system fan header, 1 × system fan/water cooling pump header
  • 3 × Addressable RGB Gen2 LED strip headers, 1 × RGB LED strip header
  • 2 × M.2 Socket 3 connectors, 4 × SATA 6Gb/s connectors
  • 1 × front panel header, 1 × front panel audio header
  • 1 × Trusted Platform Module (TPM) header
  • 1 × reset button, 1 × reset jumper, 1 × Clear CMOS jumper

Back Panel Connectors

  • 1 × HDMI port
  • 2 × DisplayPort
  • 1 × Q-Flash Plus button
  • 1 × PS/2 keyboard/mouse port
  • 1 × USB 3.2 Gen 2 Type-A port (red)
  • 1 × USB Type-C® port (USB 3.2 Gen 2)
  • 2 × USB 3.2 Gen 1 ports
  • 4 × USB 2.0/1.1 ports
  • 1 × RJ-45 2.5GbE LAN port
  • 3 × audio jacks

BIOS & Software

  • BIOS: 256 Mbit flash, licensed AMI UEFI BIOS
  • Utilities: GIGABYTE Control Center (GCC), Q-Flash, Q-Flash Plus, Smart Backup
  • OS Support: Windows® 11 64-bit, Windows® 10 64-bit

Physical Specifications & Compatibility

  • Form Factor: Micro ATX (24.4 cm × 24.4 cm)

Write a review

Please login or register to review