HARDWARE

General SpecificationsForm Factor: ATXChipset: Intel Z890Target Market: High-end desktop (HEDT), Content Creators, Power UsersProcessor SupportCPU Socket: LGA 1851Supported CPUs: Intel Core Ultra Series 2 Processors (Next-gen Raptor Lake Refresh / Arrow Lake architecture)Memory SupportSlots: 4 x DIM..

Key SpecificationsModel : Kingston 96GB DDR5-5600 ECC Registered DIMMCapacity : 96GB (1 module)Memory Type : DDR5 SDRAMSpeed/Data Rate : 5600 MT/s (PC5-44800)CAS Latency (CL) : CL46Voltage : 1.1VModule Type : Registered DIMM (RDIMM)ECC Support : Yes – Error-Correcting Code for data integrityRank Con..

Key SpecificationsModel Number : KF560C30BBA-32Capacity : 32GB (1 x 32GB module)Memory Type : DDR5 SDRAMSpeed/Data Rate : DDR5-6000 MT/s (PC5-48000)CAS Latency (CL) : CL30 (30-36-36 timings)Voltage :XMP 3.0 profile : 1.4VJEDEC default profile : 1.1V (DDR5-4800 at 40-39-39)Module Configuration : 2Rx8..

Thermal PerformanceCooling Performance : Rivals or surpasses many full-height 120mm air coolersNoise Level : Exceptionally quiet – max noise level of 22.6 dBAAirflow : Max airflow of 102.1 m³/h (~60 CFM) with NF-A12x25r PWM fanFan Speed Range : 450–2000 RPM with PWM control for dynamic speed adjustm..

Thermal PerformanceThermal Conductivity: Extremely high – comparable to quality thermal pastesThermal Resistance: Very low – ensures minimal heat bottleneck between component and heatsinkCompliance & Compressibility: Outstanding mechanical compliance for uneven surfaces and tight mounting pressu..

General InformationType: Solid thermal interface pad (non-adhesive)Use Case: Designed for CPU, GPU, memory modules, chipsets, and heatsink applicationsMaterial: High-quality silicone-based compound with thermally conductive fillersColor: GrayForm Factor: Pre-cut sheet for easy installationDimensions..

General InformationType: Solid thermal interface pad (non-adhesive, pre-cut)Use Case: Designed for CPU, GPU, VRM, M.2 SSDs, and other heat-generating componentsMaterial: High-quality silicone-based compound with thermally conductive fillersColor: GrayForm Factor: Pre-cut sheet for easy installationD..

Thermal PerformanceThermal Conductivity: 12.8 W/m·K – ensures fast and efficient heat dissipationThermal Impedance: Less than 0.01 ℃·cm²/W – minimizes resistance for improved thermal contactTemperature Range: Stable operation from -150°C to +250°C – ideal for extreme environments including overclock..

General InformationType: Silicone-based thermal interface material (TIM)Color: GrayUse Case: Designed for efficient heat transfer between CPUs, GPUs, coolers, and heatsinksFormulation: Metal-free, non-conductive formula – safe for sensitive electronicsVolume: 8 grams per syringe – ideal for multiple..

General InformationThe Thermalright Peerless Assassin 120 Digital ARGB is a high-performance dual-tower air cooler designed for modern Intel and AMD platforms.It features 6 x 6mm pure copper heat pipes , a nickel-plated C1100 copper base , and dual 120mm PWM ARGB fans for strong cooling performance ..

General InformationType: CPU anti-bending backplate for Intel LGA1851 socketDesigned For: Preventing CPU bending or warping under pressure from heavy coolers (large air coolers, AIO liquid coolers)Material: High-quality anodized aluminum alloy with sandblasted finishColor: BlackForm Factor: Custom f..

General InformationModel: Socket Reinforcement Bracket for Intel LGA1700Color: BlackMaterial: High-quality anodized aluminum alloy with sandblasted finishPurpose: Prevents CPU socket bending or warping due to heavy coolers (large air coolers or AIO liquid coolers)Compatibility:CPUs: Intel 12th Gen (..