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General InformationType: Solid thermal interface pad (non-adhesive)Use Case: Designed for CPU, GPU, memory modules, chipsets, and heatsink applicationsMaterial: High-quality silicone-based compound with thermally conductive fillersColor: GrayForm Factor: Pre-cut sheet for easy installationDimensions..

General InformationType: Solid thermal interface pad (non-adhesive, pre-cut)Use Case: Designed for CPU, GPU, VRM, M.2 SSDs, and other heat-generating componentsMaterial: High-quality silicone-based compound with thermally conductive fillersColor: GrayForm Factor: Pre-cut sheet for easy installationD..

Thermal PerformanceThermal Conductivity: 12.8 W/m·K – ensures fast and efficient heat dissipationThermal Impedance: Less than 0.01 ℃·cm²/W – minimizes resistance for improved thermal contactTemperature Range: Stable operation from -150°C to +250°C – ideal for extreme environments including overclock..

General InformationType: Silicone-based thermal interface material (TIM)Color: GrayUse Case: Designed for efficient heat transfer between CPUs, GPUs, coolers, and heatsinksFormulation: Metal-free, non-conductive formula – safe for sensitive electronicsVolume: 8 grams per syringe – ideal for multiple..

General InformationThe Thermalright Peerless Assassin 120 Digital ARGB is a high-performance dual-tower air cooler designed for modern Intel and AMD platforms.It features 6 x 6mm pure copper heat pipes , a nickel-plated C1100 copper base , and dual 120mm PWM ARGB fans for strong cooling performance ..

General InformationThe Thermalright Peerless Assassin 120 Digital ARGB is a high-performance dual-tower air cooler designed for modern Intel and AMD platforms.It features 6 x 6mm pure copper heat pipes , a nickel-plated C1100 copper base , and dual 120mm PWM ARGB fans for strong cooling performance ..

General InformationType: High-performance single-tower air CPU coolerColor: Full white finish across heatsink, heat pipes, base, and fan frameDesigned For: Compact builds on modern Intel and AMD platformsUse Case: Ideal for gaming, overclocking, and small-form-factor systems where space is limited b..

General InformationType: High-performance dual-tower air coolerDesign: Optimized for high airflow , low noise , and broad socket compatibilityUse Case: Ideal for gaming, overclocking, and workstation builds on modern Intel and AMD platformsWarranty: Not explicitly stated (typically 5–6 years for The..

General InformationType: High-performance dual-tower air coolerDesign: Optimized for high airflow , low noise , and broad socket compatibilityUse Case: Ideal for gaming, overclocking, and workstation builds on modern Intel and AMD platformsWarranty: Not explicitly stated (typically 5–6 years for The..

General InformationType: CPU anti-bending backplate for Intel LGA1851 socketDesigned For: Preventing CPU bending or warping under pressure from heavy coolers (large air coolers, AIO liquid coolers)Material: High-quality anodized aluminum alloy with sandblasted finishColor: BlackForm Factor: Custom f..

General InformationModel: Socket Reinforcement Bracket for Intel LGA1700Color: BlackMaterial: High-quality anodized aluminum alloy with sandblasted finishPurpose: Prevents CPU socket bending or warping due to heavy coolers (large air coolers or AIO liquid coolers)Compatibility:CPUs: Intel 12th Gen (..

General InformationType: All-in-One (AIO) liquid CPU coolerForm Factor: 360mm radiator for high-performance coolingColor: White with customizable RGB lightingDesigned For: High-end Intel and AMD CPUsCooling Performance & ComponentsComponentSpecificationRadiator Dimensions403 mm x 120 mm x 27 mmM..