Cooling

General InformationThe ASUS TUF Gaming TR120 ARGB Reverse Fan - Triple Pack is a high-performance cooling solution designed for gaming PCs, combining advanced airflow optimization with vibrant ARGB lighting. It features hydraulic bearing, PWM control, and Aura Sync compatibility, making it ideal for..

General InformationType: Compact 92mm tower air cooler with all-black designDesigned For: Small form factor builds, HTPCs, and systems where space is limited but performance mattersUse Case: Ideal for gaming, compact workstations, and black-themed PCsCooling Performance & DimensionsDimensions (w..

General InformationType: Compact air CPU cooler designed for small form factor buildsUse Case: Ideal for mini-ITX cases, HTPCs, and systems where space is limited but strong cooling performance is requiredDesign Highlights:Asymmetrical layout to avoid RAM and PCIe interferenceSlim footprint with ful..

General InformationType: Slim 120mm tower air CPU coolerColor: All-black edition (heatsink, fan, mounting parts)Designed For: Quiet cooling with full compatibility in modern buildsUse Case: Ideal for gaming rigs, compact systems, and black-themed PCs where silence and performance matterCooling Perfo..

General InformationType: Premium low-profile air CPU coolerDesigned For: Small form factor (SFF) builds, HTPCs, and compact systemsUse Case: Offers strong cooling performance in tight spaces while maintaining full compatibility with tall RAM and PCIe componentsColor: All-black edition – ideal for st..

ModelModel Name: Prime LC 360 ARGBWater BlockWater Block Dimension: 65.1 x 60.58 x 68.5 mmBlock Material (CPU Plate): CopperRadiatorRadiator Dimension: 397 x 120 x 27 mmRadiator Material: AluminumTube: Sleeved Rubber tubeTube Length: 400 mmFanFan Model: PRIME LC 36025 Integrated FanSize: 3 x Fan Slo..

Thermal PerformanceThermal Conductivity: Extremely high – comparable to quality thermal pastesThermal Resistance: Very low – ensures minimal heat bottleneck between component and heatsinkCompliance & Compressibility: Outstanding mechanical compliance for uneven surfaces and tight mounting pressu..

General InformationType: Solid thermal interface pad (non-adhesive)Use Case: Designed for CPU, GPU, memory modules, chipsets, and heatsink applicationsMaterial: High-quality silicone-based compound with thermally conductive fillersColor: GrayForm Factor: Pre-cut sheet for easy installationDimensions..

General InformationType: Solid thermal interface pad (non-adhesive, pre-cut)Use Case: Designed for CPU, GPU, VRM, M.2 SSDs, and other heat-generating componentsMaterial: High-quality silicone-based compound with thermally conductive fillersColor: GrayForm Factor: Pre-cut sheet for easy installationD..

Thermal PerformanceThermal Conductivity: 12.8 W/m·K – ensures fast and efficient heat dissipationThermal Impedance: Less than 0.01 ℃·cm²/W – minimizes resistance for improved thermal contactTemperature Range: Stable operation from -150°C to +250°C – ideal for extreme environments including overclock..

General InformationType: Silicone-based thermal interface material (TIM)Color: GrayUse Case: Designed for efficient heat transfer between CPUs, GPUs, coolers, and heatsinksFormulation: Metal-free, non-conductive formula – safe for sensitive electronicsVolume: 8 grams per syringe – ideal for multiple..

General InformationType: CPU anti-bending backplate for Intel LGA1851 socketDesigned For: Preventing CPU bending or warping under pressure from heavy coolers (large air coolers, AIO liquid coolers)Material: High-quality anodized aluminum alloy with sandblasted finishColor: BlackForm Factor: Custom f..