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General InformationType: Hybrid thermal paste – combines the performance of phase-change material with fine-particle TIM for high-end coolingEdition: AM5-specific version with accessories tailored for AMD Ryzen 7000-series and future AM5 CPUsUse Case: Designed for high-performance air and liquid coo..

General OverviewModel: ASUS ROG Strix GeForce RTX 5070 Ti 16GB GDDR7 OC EditionTarget Use: High-end gaming, 4K/8K content creation, VR, and AI workloadsGPU Architecture: NVIDIA Ada Lovelace (RTX 50 Series)Form Factor: Triple-slotLength: Approx. 320–360 mmGPU SpecificationsGPU Model: NVIDIA GeForce R..

General OverviewModel: ASUS PRIME GeForce RTX 5080 16GB GDDR7 OC EditionTarget Use: High-end gaming, professional content creation, 8K renderingGPU Architecture: NVIDIA Ada Lovelace (RTX 50 Series)Form Factor: Triple-slot designLength: Approx. 360 mmDesign Feature: SFF (Small Form Factor) readyGPU S..

Thermal PerformanceThermal Conductivity: 12.8 W/m·K – ensures fast and efficient heat dissipationThermal Impedance: Less than 0.01 ℃·cm²/W – minimizes resistance for improved thermal contactTemperature Range: Stable operation from -150°C to +250°C – ideal for extreme environments including overclock..

General InformationType: Silicone-based thermal interface material (TIM)Color: GrayUse Case: Designed for efficient heat transfer between CPUs, GPUs, coolers, and heatsinksFormulation: Metal-free, non-conductive formula – safe for sensitive electronicsVolume: 8 grams per syringe – ideal for multiple..

Thermal PerformanceThermal Conductivity: 14 W/m·K – excellent heat transfer efficiencyThermal Impedance: <0.01 ℃·cm²/W – minimal resistance for improved cooling performanceUsable Temperature Range: -220°C to 380°C – suitable for extreme overclocking and industrial applicationsViscosity: Optimized..

General InformationModel: Conductonaut Black EditionType: Pre-cut thermal padsQuantity: 4 pads per packDimensions: 120 mm x 20 mm x 3.0 mmColor: BlackMaterial Composition: Ceramic silicon formula complex with nano aluminum oxide for improved heat transferThermal Performance: Enhanced over Basic seri..

General InformationModel: Ryzen 7 5700XArchitecture: Zen 3 (Vermeer)Socket: AM4Manufacturing Process: TSMC 7nm FinFETTDP: 65WIntegrated Graphics: None – requires discrete GPU for display outputUnlocked Multiplier: Yes – supports overclocking via compatible motherboardsLaunch Date: March 2022Core &am..

Graphics EngineModel: NVIDIA® GeForce RTX™ 5060 TiAI Performance: 772 TOPs (Tera Operations Per Second)Bus Standard: PCI Express 5.0 x16Video Memory: 8GB GDDR7Memory Interface: 128-bitEngine Clock:OC Mode: 2647 MHzDefault Mode: 2617 MHz (Boost Clock)CUDA Cores: 4608Memory Speed: 28 GbpsDisplay Suppo..

Graphics EngineModel: NVIDIA® GeForce RTX™ 5060 TiAI Performance: 767 TOPs (Tera Operations Per Second)Bus Standard: PCI Express 5.0 x16Video Memory: 16GB GDDR7Memory Interface: 128-bitEngine Clock:OC Mode: 2632 MHzDefault Mode: 2602 MHz (Boost Clock)CUDA Cores: 4608Memory Speed: 28 GbpsDisplay Supp..

General InformationCase Type: MFF (Micro Form Factor)Material: Steel (with mesh panels for airflow)Form Factor: Mini-ATX (M-ATX) and Mini-ITX compatibility.Capacity: 26.3L (compact design for small builds).Warranty: 1 year limited hardware warranty.Physical DimensionsDimensions (Depth x Width x Heig..

General InformationCase Type: MFF (Micro Form Factor)Material: Steel (with mesh panels for airflow)Form Factor: Mini-ATX (M-ATX) and Mini-ITX compatibility.Capacity: 26.3L (compact design for small builds).Warranty: 1 year limited hardware warranty.Physical DimensionsDimensions (Depth x Width x Heig..