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Thermal PerformanceThermal Conductivity: Extremely high – comparable to quality thermal pastesThermal Resistance: Very low – ensures minimal heat bottleneck between component and heatsinkCompliance & Compressibility: Outstanding mechanical compliance for uneven surfaces and tight mounting pressu..

General InformationType: Solid thermal interface pad (non-adhesive)Use Case: Designed for CPU, GPU, memory modules, chipsets, and heatsink applicationsMaterial: High-quality silicone-based compound with thermally conductive fillersColor: GrayForm Factor: Pre-cut sheet for easy installationDimensions..

General InformationType: Solid thermal interface pad (non-adhesive, pre-cut)Use Case: Designed for CPU, GPU, VRM, M.2 SSDs, and other heat-generating componentsMaterial: High-quality silicone-based compound with thermally conductive fillersColor: GrayForm Factor: Pre-cut sheet for easy installationD..

Thermal PerformanceThermal Conductivity: 12.8 W/m·K – ensures fast and efficient heat dissipationThermal Impedance: Less than 0.01 ℃·cm²/W – minimizes resistance for improved thermal contactTemperature Range: Stable operation from -150°C to +250°C – ideal for extreme environments including overclock..

General InformationType: Silicone-based thermal interface material (TIM)Color: GrayUse Case: Designed for efficient heat transfer between CPUs, GPUs, coolers, and heatsinksFormulation: Metal-free, non-conductive formula – safe for sensitive electronicsVolume: 8 grams per syringe – ideal for multiple..

Thermal PerformanceThermal Conductivity: 14 W/m·K – excellent heat transfer efficiencyThermal Impedance: <0.01 ℃·cm²/W – minimal resistance for improved cooling performanceUsable Temperature Range: -220°C to 380°C – suitable for extreme overclocking and industrial applicationsViscosity: Optimized..

Thermal PerformanceThermal Conductivity: 12.8 W/m·K – delivers excellent heat transfer efficiencyThermal Impedance: < 0.01 ℃·cm²/W – ensures minimal resistance for efficient coolingViscosity: Optimized for smooth, even application and full surface coverageTemperature Range: -150°C to 250°C – suit..

ProcessorModel: AMD Ryzen™ 7 7435HSCores/Threads: 8 coresBase/Boost Clock: Up to 4.5 GHzMemoryType: 16GB DDR5-4800 SO-DIMM RAMStorageCapacity: 512GB PCIe® 4.0 NVMe™ M.2 SSDGraphicsGPU: NVIDIA® GeForce RTX™ 4050 Laptop GPUVRAM: 6GB GDDR6Power: 140W TDP (enhanced performance for gaming and creative ta..

ProcessorModel: AMD Ryzen™ 7 7435HSCores/Threads: 8 cores (performance + efficiency cores)Base/Boost Clock: Up to 4.5 GHzUse Case: Handles multitasking, gaming, and demanding applications with ease.MemoryType: 16GB DDR5-4800 SO-DIMM RAMBenefits: Fast, efficient multitasking and responsiveness for in..

Processor (Intel® Core™ i7-13620H):10 cores (6 Performance + 4 Efficiency cores) with up to 4.9 GHz boost clock .Ideal for multitasking, gaming, and productivity.Supports Intel® Turbo Boost Technology 2.0 & Max 3.0 for adaptive performance.Graphics (NVIDIA GeForce RTX 4070 8GB GDDR6):Dedicated G..

ProcessorModel: Intel® Core™ i7-13620HCores/Threads: 10 cores (6 performance + 4 efficiency)Base/Boost Clock: Up to 4.9 GHzUse Case: Handles multitasking, gaming, and demanding applications with ease.MemoryType: 16GB (2 x 8GB) DDR5-4800 SO-DIMMBenefits: Dual-channel configuration ensures smooth perf..

Operating System:Windows 11 HomeProcessor:13th Gen Intel® Core™ i7-13620H Processor2.4 GHz (24M Cache, up to 4.9 GHz)10 cores (6 P-cores and 4 E-cores)Graphics:NVIDIA® GeForce RTX™ 4050 Laptop GPU194 AI TOPsBoost Clock: 2420 MHz at 140W (2370 MHz Boost Clock + 50 MHz OC, 115W + 25W Dynamic Boost)6GB..