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Model NameASUS TUF GAMING B860M-PLUS Micro-ATX MotherboardBrandASUS / TUF GAMINGCPU & ChipsetCPU Socket: Intel® LGA1851Supported Processors: Intel® Core™ Ultra Processors (Series 2)Chipset: Intel® B860Technologies Supported: Intel® Turbo Boost Technology 2.0, Intel® Turbo Boost Max Technology 3...

Model NameASUS PRIME B860M-A-CSM Micro-ATX MotherboardBrandASUS / PRIME CSMCPU & ChipsetCPU Socket: Intel® LGA1851Supported Processors: Intel® Core™ Ultra Processors (Series 2)Chipset: Intel® B860Technologies Supported: Intel® Turbo Boost Technology 2.0, Intel® Turbo Boost Max Technology 3.0 (CP..

Model NameGIGABYTE H810M GAMING WIFI6 Micro ATX MotherboardBrandGIGABYTECPU & ChipsetCPU Socket: LGA1851Supported Processors: Intel® Core™ Ultra ProcessorsChipset: Intel® H810 Express ChipsetMemoryMemory Type: DDR5Memory Slots: 2 × DDR5 DIMM sockets (Dual-channel architecture)Maximum Capacity: 1..

Model NameGIGABYTE B860M EAGLE WIFI6 V2 Micro ATX MotherboardBrandGIGABYTE / EAGLECPU & ChipsetCPU Socket: LGA1851Supported Processors: Intel® Core™ Ultra Processors (Series 2 / Arrow Lake-S)Chipset: Intel® B860 Express ChipsetMemoryMemory Type: DDR5Memory Slots: 4 × DDR5 DIMM sockets (Dual-chan..

Model NameGIGABYTE H810M-K Micro ATX MotherboardBrandGIGABYTECPU & ChipsetCPU Socket: LGA1851Supported Processors: Intel® Core™ Ultra ProcessorsChipset: Intel® H810 Express ChipsetL3 Cache: Varies with CPU selectionMemoryMemory Type: DDR5Memory Slots: 2 × DDR5 DIMM socketsMaximum Capacity: 128 G..

CPU SpecificationsTotal Cores: 20 (8 Performance-cores, 12 Efficient-cores)Total Threads: 20Max Turbo Frequency: 5.5 GHzIntel® Turbo Boost Max Technology 3.0 Frequency: 5.5 GHzPerformance-core Max Turbo Frequency: 5.4 GHzEfficient-core Max Turbo Frequency: 4.6 GHzPerformance-core Base Frequency: 3.9..

General InformationModel: PRIME H810M-A-CSMForm Factor: micro-ATXDimensions: 9.6 inches × 8.75 inches (24.4 cm × 22.2 cm)CPUSocket: LGA1851Processor Support:Intel® Core™ Ultra Processors (Series 2)Supports Intel® Turbo Boost Technology 2.0 and Intel® Turbo Boost Max Technology 3.0 (depends on CPU ty..

General InformationModel: HYTE Solid Processor Frame Pitch BlackWarranty: 3 YearsCPU CompatibilityIntel LGA 1851: Compatible with Core Ultra 200S processorsIncluded ComponentsWrench: Included, L-ShapedThermal Paste: Included, 2g HYTE Thermal GoopFeaturesDesign: Universal mount designed for various C..

General InformationModel: XPG MAESTRO PLUS 62DAColor: BlackWarranty: 2 YearsWeight: 1.4kgDimensions: 120 x 160 x 126 mmTDP Support: Up to 250WCPU Socket SupportIntel: LGA 1851, 1700, 1200, 115xAMD: AM5, AM4, AM3DesignCooler Type: Dual-Tower DesignHeat Pipes: 6 heat pipesFanFan Dimension: 120 x 120 x..

General InformationColor: BlackWarranty: 2 YearsWeight: 571gDimensions: 120 x 156 x 71 mmCPU Socket SupportIntel: LGA 1851, 1700, 1200, 115xAMD: AM5, AM4, AM3FanFan Dimension: 120 x 120 x 25 mmBearing Type: Fluid Dynamic Bearing (FDB)Fan Speed: 800 – 1,800 RPM ±10%Fan Static Pressure: 1.39 mm-H2OFan..

Cooling SystemWater Block Dimensions: 91.4 x 91.4 x 62.3 mmBlock Material (CPU Plate): CopperPump Solution: Asetek pumpMotor Speed: 800–3600 RPM ±300 RPMPower: 12V DC, 4.3W, 1.1ARadiatorRadiator Dimensions: 394 x 120 x 27 mmRadiator Material: AluminumTube Type: Sleeved Rubber TubeTube Length: 400 mm..

Cooling Type: High-performance air cooler with dual Mobius 120P PWM fans in push-pull configurationHeat Pipes: 6 patented Superconductive Composite Copper Heat Pipes ("SCHP") with direct contact heat pipe design for efficient thermal transferFans: 2 x 120 mm Mobius 120P fansFan Speed: 0 to 2400 RPM ..