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Model NameSamsung 9100 ProCapacity2 TBInterfacePCIe 5.0 x4 (NVMe 2.0)Form FactorM.2 2280Sequential Read SpeedUp to 14,700 MB/sSequential Write SpeedUp to 13,400 MB/sRandom Read/Write PerformanceUp to 2,600K IOPSNAND TypeSamsung V-NAND TLCControllerSamsung in-house 5nm controllerFeaturesTRIM supportS..

CPU SpecificationsTotal Cores: 20Performance-cores (P-cores): 8Efficient-cores (E-cores): 12Total Threads: 28Max Turbo Frequency: 5.6 GHzP-core Max Turbo: 5.5 GHzE-core Max Turbo: 4.3 GHzBase Frequencies:P-core: 3.4 GHzE-core: 2.5 GHzCache:L2 Cache: 28 MBL3 Smart Cache: 33 MBThermal Design Power (TD..

CPU SpecificationsTotal Cores: 20 (8 Performance-cores, 12 Efficient-cores)Total Threads: 20Max Turbo Frequency: 5.5 GHzIntel® Turbo Boost Max Technology 3.0 Frequency: 5.5 GHzPerformance-core Max Turbo Frequency: 5.4 GHzEfficient-core Max Turbo Frequency: 4.6 GHzPerformance-core Base Frequency: 3.9..

Family / SeriesRyzen 3000 Series (Codename: Matisse)Form FactorDesktopCPU Cores / Threads12 cores / 24 threadsClock SpeedsBase Clock: 3.1 GHzMax Boost Clock: Up to 4.3 GHzCacheL1 Cache: 768 KBL2 Cache: 6 MBL3 Cache: 64 MBTDP65WManufacturing ProcessTSMC 7nm FinFETSocketAM4Memory SupportType: DDR4Chan..

Model NameAMD Ryzen™ 5 7400Family / SeriesRyzen 7000 Series (Codename: Raphael)Form FactorDesktop, Boxed ProcessorMarket SegmentMainstream / Enthusiast DesktopProcessor ArchitectureZen 4CPU Cores / Threads6 cores / 12 threadsClock SpeedsBase Clock: 3.3 GHzMax Boost Clock: Up to 4.3 GHzCacheL1 Cache:..

Headset TypeOver-Ear Gaming HeadsetAudioVirtual 7.1 Surround SoundSpeaker Driver: 50 mmFrequency Response: 20 Hz – 20,000 HzSensitivity: 109 dBImpedance: 32 ΩTotal Harmonic Distortion (THD): ≤5%Volume Control: On ear cupMicrophoneDetachable: YesDesign: Flexible boomPattern: OmnidirectionalSensitivit..

Model NameHG31Headset TypeOver-EarConnectivityWired USB-ADriver Size53 mmSpeaker SpecificationsSensitivity: 119 ± 3 dBImpedance: 32 Ω ± 15%Frequency Response: 20 Hz – 20 kHzMicrophone SpecificationsType: OmnidirectionalSensitivity: –38 ± 3 dBImpedance: ≤2.2 kΩDimension: 6.0 × 5.0 mmCable & Physi..

Model NameHELIOS M2-850BPower Supply TypeATX12V v3.1Rated Power850WPeak Power1105WEfficiency Certification80 PLUS SilverPower Factor CorrectionActive PFC (PF = 0.99)Dimensions (L × W × H)140 × 150 × 86 mmAC Input100–240V ~ / 10A / 50–60HzDC Output Rails+3.3V: up to 22A (120W max combined with +5V)+5..

Model NameHELIOS P2-850GPower Supply TypeATX12V v3.1Rated Power850WPeak Power1105WEfficiency Certification80 PLUS GoldPower Factor CorrectionActive PFC (PF = 0.99)Dimensions (L × W × H)140 × 150 × 86 mmAC Input100–240V ~ / 12–6A / 50–60HzDC Output Rails+3.3V: up to 20A (100W max combined with +5V)+5..

Model NameATHENA P3Case TypeMid TowerMotherboard SupportE-ATXATXMicro-ATXMini-ITXCase ColorBlackMaterialsSPCC Steel, ABS Plastic, Tempered GlassWindow PanelLeft side (Tempered Glass)Expansion Slots7Drive Bays2 × 3.5" HDD or 2 × 2.5" SSD + 1 × 3.5" HDD (in HDD cage)1 × 2.5" SSD (on dedicated bracket)..

Model NameNESO P1 PRO WWCase TypeFull TowerMotherboard SupportE-ATX (up to 310mm width)ATXMicro-ATXMini-ITXCase ColorWhiteMaterialsSPCC Steel, ABS Plastic, Tempered GlassWindow PanelsFront and Left side (Tempered Glass)Expansion Slots8Drive Bays2 × 3.5" HDD or 1 × 2.5" + 1 × 3.5" (in HDD cage)2 × 2...

Model NameAMD Ryzen™ 7 9850X3DFamily / SeriesRyzen 9000 Series (Granite Ridge)Form FactorDesktop, Boxed ProcessorMarket SegmentEnthusiast DesktopProcessor ArchitectureZen 5CPU Cores / Threads16 cores / 32 threadsClock SpeedsBase Clock: 4.7 GHzMax Boost Clock: Up to 5.6 GHzCacheL1 Cache: 640 KBL2 Cac..