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General InformationThe Noctua NH-D15 G2 is the second-generation flagship dual-tower air cooler, offering improved thermal performance and quieter operation over its predecessor.Designed for high-end Intel and AMD CPUs in gaming, workstation, and content creation systems.Includes premium NT-H2 therm..

General OverviewModel: Cougar UNIFACE Mini RGBForm Factor: Mini TowerTarget Use: Compact gaming, SFF enthusiast buildsDesign Focus: Small footprint with strong cooling, RGB lighting, and modern I/OMotherboard CompatibilitySupported Form Factors:Mini ITXMicro ATXPhysical DimensionsCase Dimensions (W ..

General OverviewModel: Cougar MX410Form Factor: Mid TowerTarget Use: Gaming, mid-range to high-end performance buildsDesign Focus: Compact size with strong cooling, RGB aesthetics, and clean cable managementMotherboard CompatibilitySupported Form Factors:Mini ITXMicro ATXATXPhysical DimensionsCase D..

General OverviewModel: TUF-GAMING-750BPower Output: 750W continuousTarget Use: Mid-range to high-end gaming PCs, workstation buildsForm Factor: Standard ATX (150 x 150 x 86 mm)Modular Design: Non-modular (fixed cables)Power & EfficiencyEfficiency Certification: 80 PLUS BronzeTypical Efficiency: ..

General OverviewModel: ASUS ROG Strix GeForce RTX 5070 Ti 16GB GDDR7 OC EditionTarget Use: High-end gaming, 4K/8K content creation, VR, and AI workloadsGPU Architecture: NVIDIA Ada Lovelace (RTX 50 Series)Form Factor: Triple-slotLength: Approx. 320–360 mmGPU SpecificationsGPU Model: NVIDIA GeForce R..

General OverviewModel: ASUS PRIME GeForce RTX 5080 16GB GDDR7 OC EditionTarget Use: High-end gaming, professional content creation, 8K renderingGPU Architecture: NVIDIA Ada Lovelace (RTX 50 Series)Form Factor: Triple-slot designLength: Approx. 360 mmDesign Feature: SFF (Small Form Factor) readyGPU S..

Thermal PerformanceThermal Conductivity: Extremely high – comparable to quality thermal pastesThermal Resistance: Very low – ensures minimal heat bottleneck between component and heatsinkCompliance & Compressibility: Outstanding mechanical compliance for uneven surfaces and tight mounting pressu..

General InformationType: Solid thermal interface pad (non-adhesive)Use Case: Designed for CPU, GPU, memory modules, chipsets, and heatsink applicationsMaterial: High-quality silicone-based compound with thermally conductive fillersColor: GrayForm Factor: Pre-cut sheet for easy installationDimensions..

General InformationType: Solid thermal interface pad (non-adhesive, pre-cut)Use Case: Designed for CPU, GPU, VRM, M.2 SSDs, and other heat-generating componentsMaterial: High-quality silicone-based compound with thermally conductive fillersColor: GrayForm Factor: Pre-cut sheet for easy installationD..

Thermal PerformanceThermal Conductivity: 12.8 W/m·K – ensures fast and efficient heat dissipationThermal Impedance: Less than 0.01 ℃·cm²/W – minimizes resistance for improved thermal contactTemperature Range: Stable operation from -150°C to +250°C – ideal for extreme environments including overclock..

General InformationType: Silicone-based thermal interface material (TIM)Color: GrayUse Case: Designed for efficient heat transfer between CPUs, GPUs, coolers, and heatsinksFormulation: Metal-free, non-conductive formula – safe for sensitive electronicsVolume: 8 grams per syringe – ideal for multiple..

General InformationType: CPU anti-bending backplate for Intel LGA1851 socketDesigned For: Preventing CPU bending or warping under pressure from heavy coolers (large air coolers, AIO liquid coolers)Material: High-quality anodized aluminum alloy with sandblasted finishColor: BlackForm Factor: Custom f..