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Products meeting the search criteria
Brand: Asus
Model: PRIME B550M-K
Model NamePRIME B550M-KBrandASUSForm FactorMicro-ATX (24.4 cm × 24.4 cm / 9.6 inch × 9.6 inch)Processor & Chipset SpecificationsCPU Socket: AMD AM4CPU Support: AMD Ryzen™ 5000 Series, 5000 G-Series, 4000 G-Series, and 3000 Series Desktop ProcessorsChipset: AMD B550Memory SpecificationsMemory Typ..
4,300 EGP
Brand: Gigabyte
Model: B760M DS3H WIFI6E DDR4 GEN5
Model NameB760M DS3H WIFI6E DDR4 GEN5BrandGIGABYTEForm FactorMicro-ATX (24.4 cm × 24.4 cm)Processor & Chipset SpecificationsCPU Socket: LGA 1700CPU Support: 14th, 13th, and 12th Generation Intel Core, Pentium Gold, and Celeron ProcessorsChipset: Intel B760 Express ChipsetMemory SpecificationsSlo..
7,100 EGP
Brand: coolermaster
Model: MasterFrame 360 Stage LCD Mid-Tower PC Case
Model NameCooler Master MasterFrame 360 Stage LCD Mid-Tower PC CaseBrandCooler Master / MASTERFRAME SeriesModel NumberMF360-KHNN-S02Design & BuildCase Type: Mid Tower (Enclosed Showcase Design with LCD)Color: BlackMaterials:Exterior: SGCC SteelSide Panels: Tempered Glass (Left & Right)Dimens..
16,499 EGP 17,000 EGP
Brand: coolermaster
Model: MasterFrame 360 Panorama Mid-Tower PC Case
Model NameCooler Master MasterFrame 360 Panorama Mid-Tower PC CaseBrandCooler Master / MASTERFRAME SeriesModel NumberMF360-KINN-S00Design & BuildCase Type: Mid Tower (Enclosed Panoramic Design)Color: BlackMaterials:Exterior: SGCC SteelSide Panels: Tempered Glass (Left & Right)Dimensions:With..
11,499 EGP 12,000 EGP
Brand: Asus
Model: PRIME H810M-A-CSM
General InformationModel: PRIME H810M-A-CSMForm Factor: micro-ATXDimensions: 9.6 inches × 8.75 inches (24.4 cm × 22.2 cm)CPUSocket: LGA1851Processor Support:Intel® Core™ Ultra Processors (Series 2)Supports Intel® Turbo Boost Technology 2.0 and Intel® Turbo Boost Max Technology 3.0 (depends on CPU ty..
5,350 EGP
Brand: Gigabyte
Model: TRX50 AERO D
CPU SupportAMD Socket sTR5 supporting AMD Ryzen Threadripper 7000/9000 Series processorsChipsetAMD TRX50Memory8 x DDR5 ECC Registered DIMM (RDIMM) socketsMaximum capacity: Up to 1TB memory support8-channel memory architectureAdvanced DDR5 features including Auto Booster, High Bandwidth mode, and Low..
34,500 EGP
Brand: Gigabyte
Model: B840M EAGLE WIFI6
CPU SupportAMD Socket AM5 for AMD Ryzen 9000, 8000, and 7000 Series processorsChipsetAMD B840Memory2 x DDR5 DIMM sockets supporting up to 128GB (64GB per DIMM)DDR5 speeds: 7600(OC)/7200(OC)/7000(OC)/6800(OC)/6600(OC)/6400(OC)/6200(OC)/6000(OC)/5800(OC)/5600(OC)/5200/4800/4400 MT/sDual channel memory..
6,150 EGP
Brand: MSI
Model: B840M GAMING WIFI6E
6,750 EGP
Brand: HYTE
Model: CS-HYTE-Y70-TM
General InformationThe HYTE Y70 Dual-Chamber ATX Mid-Tower Case is a premium, high-performance PC chassis designed for gaming, content creation, and high-end desktop builds. It features a dual-chamber layout, panoramic tempered glass side panels, and massive cooling support, making it ideal for enth..
11,500 EGP
Brand: HYTE
Model: CS-HYTE-Y70-WW
General InformationThe HYTE Y70 Dual-Chamber ATX Mid-Tower Case is a premium, high-performance PC chassis designed for gaming, content creation, and high-end desktop builds. It features a dual-chamber layout, panoramic tempered glass side panels, and massive cooling support, making it ideal for enth..
11,500 EGP
Brand: HYTE
Model: CS-HYTE-Y70-BW
General InformationThe HYTE Y70 Dual-Chamber ATX Mid-Tower Case is a premium, high-performance PC chassis designed for gaming, content creation, and high-end desktop builds. It features a dual-chamber layout, panoramic tempered glass side panels, and massive cooling support, making it ideal for enth..
11,500 EGP
Brand: HYTE
Model: CS-HYTE-Y70-BR
General InformationThe HYTE Y70 Dual-Chamber ATX Mid-Tower Case is a premium, high-performance PC chassis designed for gaming, content creation, and high-end desktop builds. It features a dual-chamber layout, panoramic tempered glass side panels, and massive cooling support, making it ideal for enth..
11,500 EGP




























