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- Model: TG-MP8-100-100-05-1R
Dimensions and format: 100 × 100 × 0.5 mm; single sheet; pink color for easy identification in assemblies.
Material and performance: Ceramic‑silicone matrix with nano aluminum oxide, providing high thermal conductivity and high compressibility to conform to uneven surfaces and minimize contact resistance.
Electrical insulation: Dielectric strength 8 kV/mm per ASTM D149, suitable around VRMs, memory, SSD controllers, and GPU backplates where short‑circuit protection is critical.
Hardness: Shore 00‑60, very soft and compliant for effective sealing under low mounting pressure and tight tolerances.
Operating temperature: −100°C to +250°C, ensuring stability from sub‑zero to high‑heat environments in PCs and electronics.
Flammability and compliance: UL94 V‑0 flame rating; RoHS compliant and eco‑friendly production.
Thermal conductivity: Commonly specified at 8 W/m·K for Minus Pad 8 series, aligning with the product designation.
Series context: Minus Pad 8 is available in 30×30, 120×20, and 100×100 mm sizes and 0.5/1.0/1.5/2.0/3.0 mm thicknesses; this SKU is the large 0.5 mm sheet suited to cutting custom shapes for M.2, VRM, RAM, and backplate applications with very tight gaps.