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- Model: TG-MP8-100-100-15-1R
Dimensions and format: 100 × 100 × 1.5 mm single sheet; pink color for easy identification in assemblies.
Material and performance: Ceramic‑silicone composite with nano Al₂O₃, offering high thermal conductivity and high compressibility to minimize contact resistance across component height variations.
Electrical insulation: Dielectric strength 8 kV/mm per ASTM D149, appropriate for VRMs, memory, SSD controllers, and GPU backplates where short‑circuit protection is essential.
Hardness: Shore 00‑60, very soft and compliant to achieve effective sealing under low mounting pressure and tight tolerances.
Operating temperature: −100°C to +250°C for stable performance from sub‑zero to high‑heat environments in PCs and electronics.
Flammability and compliance: UL94 V‑0 flammability rating; RoHS compliant and eco‑friendly production.
Thermal conductivity: Commonly listed at 8 W/m·K for Minus Pad 8 series, aligning with the product designation and typical retailer/datasheet specs.
Series context: Minus Pad 8 is offered in 30×30, 120×20, and 100×100 mm formats and 0.5/1.0/1.5/2.0/3.0 mm thicknesses; this SKU is the large 1.5 mm sheet suited to cutting custom pieces for backplates, VRMs, and modules with moderate standoff gaps.