HARDWARE

CPUSocket: Intel® LGA1851 for Intel® Core™ Ultra Processors (Series 2).Turbo Boost: Supports Intel® Turbo Boost Technology 2.0 and Intel® Turbo Boost Max Technology 3.0.Compatibility: Refer to ASUS support for the CPU compatibility list.ChipsetIntel® B860 Chipset for excellent performance and connec..

CPUSocket: Intel® LGA1851, supports Intel® Core™ Ultra Processors (Series 2).Turbo Boost: Intel® Turbo Boost Technology 2.0 and Turbo Boost Max Technology 3.0 supported.Compatibility: Refer to ASUS support for CPU compatibility.ChipsetIntel® Z890 Chipset for advanced system performance.MemoryDIMM Sl..

CPUSupport: Intel® Core™ Ultra Processors (Series 2).Features: Intel® Turbo Boost Technology 2.0 and Turbo Boost Max Technology 3.0.Note: Refer to the ASUS support page for the CPU compatibility list.ChipsetIntel® Z890 Chipset for advanced performance and connectivity.MemorySlots: 4 x DIMM, supporti..

Key FeaturesHigh Airflow DesignOptimized ventilation ensures efficient cooling for internal components, keeping your system running at peak performance.Spacious InteriorCompatible with ATX, Micro-ATX, and Mini-ITX motherboards.Provides enough room for high-end GPUs and multiple storage drives, ideal..

SpecificationsDimensions and BuildSize: 430 x 238 x 495mm (L x W x H).Material: Durable steel construction for long-lasting reliability.Motherboard SupportCompatible with a wide range of motherboards:E-ATX (up to a width of 28.5cm).ATX (supports back plug).Micro-ATX.Mini-ITX.Drive BaysHDD Cage: Supp..

Key FeaturesMaterial and BuildMaterial: 1.0mm thick SPCC steel for durability.Dimensions: 552 x 271 x 773mm (L x W x H).Drive BaysHDD & SSD Tray: Supports up to 9 trays (3.5″ or 2.5″).MB Panel SSD Tray: Holds up to 3 (2.5″).Rear MB Panel Tray: Holds up to 4 (2.5″).Expansion SlotsTotal of 9 stand..

Key FeaturesCooling Efficiency:TDP rated up to 320W, making it an excellent choice for high-performance CPUs.High airflow fans and robust aluminum radiator ensure effective heat dissipation.Customizable Aesthetics:3.4” LCD Pump Head with visuals that add flair to your PC setup.Addressable RGB Rainbo..

Key FeaturesRadiator:Dimensions: 394 x 120 x 27mmMaterial: Aluminum for effective heat dissipation.Pump:Dimensions: 82 x 68 x 47mmBearing: Durable ceramic bearing.Speed: 600~3000 RPM ±10%.Noise Level: ≤15dBA for quiet operation.Power:Voltage: 12VDCCurrent: 0.33APower Consumption: ≤3.98WAesthetics: F..

ModelROG STRIX B860-A GAMING WIFICPUSupport: Intel® Core™ Ultra Processors (Series 2)Supports: Intel® Turbo Boost Technology 2.0 and Intel® Turbo Boost Max Technology 3.0ChipsetIntel® B860 ChipsetMemory4 x DIMM slots, max. 256GB, DDR5Supports up to 8600+MT/s (OC), Non-ECC, Un-buffered, Clocked Unbuf..

ModelPRIME X870-PCPUAMD Socket AM5 for AMD Ryzen™ 9000 & 8000 & 7000 Series Desktop ProcessorsChipsetAMD X870 ChipsetMemory4 x DIMM slots, max. 256GB, DDR5Supports up to 8000+MT/s(OC) with Ryzen™ 9000 & 8000 & 7000 Series Processors, ECC and Non-ECC, Un-buffered DIMMDual channel memo..

ModelPRIME B860M-KCPUSupports: Intel® Core™ Ultra Processors (Series 2), LGA1851Supports: Intel® Turbo Boost Technology 2.0 and Intel® Turbo Boost Max Technology 3.0ChipsetIntel® B860 ChipsetMemory2 x DIMM slots, max. 128GB, DDR5Supports up to 8800+MT/s (OC), Non-ECC, Un-buffered, Clocked Unbuffered..

ModelPRIME B840M-A WIFICPUAMD Socket AM5 for AMD Ryzen™ 9000 & 8000 & 7000 Series Desktop ProcessorsChipsetAMD B840 ChipsetMemory4 x DIMM slots, max. 256GB, DDR5Supports up to 7600+MT/s (OC) with Ryzen™ 9000 & 8000 & 7000 Series Processors, ECC and Non-ECC, Un-buffered DIMMDual chann..