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General SpecificationsForm Factor: ATXChipset: Intel Z890Target Market: High-end desktop (HEDT), Content Creators, Power UsersProcessor SupportCPU Socket: LGA 1851Supported CPUs: Intel Core Ultra Series 2 Processors (Next-gen Raptor Lake Refresh / Arrow Lake architecture)Memory SupportSlots: 4 x DIM..

Key SpecificationsModel : Kingston NV3 2TBCapacity : 2TB (2000GB)Form Factor : M.2 2280 (single-sided)Interface : PCIe 4.0 x4 NVMe 1.4Controller : Silicon Motion SM2268XT2 (Dual-core ARM Cortex-R8, 12nm process)NAND Type : Kioxia BiCS6 3D QLC NAND (162-layer)Sequential Read Speed : Up to 6,000 MB/sS..

Key SpecificationsModel : Kingston 96GB DDR5-5600 ECC Registered DIMMCapacity : 96GB (1 module)Memory Type : DDR5 SDRAMSpeed/Data Rate : 5600 MT/s (PC5-44800)CAS Latency (CL) : CL46Voltage : 1.1VModule Type : Registered DIMM (RDIMM)ECC Support : Yes – Error-Correcting Code for data integrityRank Con..

Key SpecificationsModel Number : KF564C32RSK2-64Capacity : 64GB (2 x 32GB modules)Memory Type : DDR5 SDRAMSpeed/Data Rate : DDR5-6400 MT/s (PC5-51200)CAS Latency (CL) : CL32 (32-39-39 timings)Voltage : 1.4VModule Configuration : Dual Rank (2Rx8 per module)Form Factor : 288-pin DIMMRGB Lighting : Yes..

Key SpecificationsModel Number : KF560C30BBA/16Capacity : 16GB (1 x 16GB module)Memory Type : DDR5 SDRAMSpeed/Data Rate : 6000 MT/s (PC5-48000)CAS Latency (CL) : CL30 (30-36-36)Voltage :XMP 3.0 profile : 1.4VJEDEC default profile : 1.1V (DDR5-4800 at 40-39-39)Module Configuration : 1Rx8 (Single Rank..

Thermal PerformanceCooling Performance : Rivals or surpasses many full-height 120mm air coolersNoise Level : Exceptionally quiet – max noise level of 22.6 dBAAirflow : Max airflow of 102.1 m³/h (~60 CFM) with NF-A12x25r PWM fanFan Speed Range : 450–2000 RPM with PWM control for dynamic speed adjustm..

Thermal PerformanceThermal Conductivity: Extremely high – comparable to quality thermal pastesThermal Resistance: Very low – ensures minimal heat bottleneck between component and heatsinkCompliance & Compressibility: Outstanding mechanical compliance for uneven surfaces and tight mounting pressu..

General InformationType: Solid thermal interface pad (non-adhesive)Use Case: Designed for CPU, GPU, memory modules, chipsets, and heatsink applicationsMaterial: High-quality silicone-based compound with thermally conductive fillersColor: GrayForm Factor: Pre-cut sheet for easy installationDimensions..

General InformationType: Solid thermal interface pad (non-adhesive, pre-cut)Use Case: Designed for CPU, GPU, VRM, M.2 SSDs, and other heat-generating componentsMaterial: High-quality silicone-based compound with thermally conductive fillersColor: GrayForm Factor: Pre-cut sheet for easy installationD..

Thermal PerformanceThermal Conductivity: 12.8 W/m·K – ensures fast and efficient heat dissipationThermal Impedance: Less than 0.01 ℃·cm²/W – minimizes resistance for improved thermal contactTemperature Range: Stable operation from -150°C to +250°C – ideal for extreme environments including overclock..

General InformationType: Silicone-based thermal interface material (TIM)Color: GrayUse Case: Designed for efficient heat transfer between CPUs, GPUs, coolers, and heatsinksFormulation: Metal-free, non-conductive formula – safe for sensitive electronicsVolume: 8 grams per syringe – ideal for multiple..

General InformationThe Thermalright Peerless Assassin 120 Digital ARGB is a high-performance dual-tower air cooler designed for modern Intel and AMD platforms.It features 6 x 6mm pure copper heat pipes , a nickel-plated C1100 copper base , and dual 120mm PWM ARGB fans for strong cooling performance ..