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General InformationSeries: Cryofuze SeriesProduct Number: MGY-ADS6-N03G-R1Colors Available: Red, Yellow, Green, Blue, Black, WhitePhysical PropertiesViscosity / Flowability: 100 Pa·s @ 22°CSpecific Gravity: 3.0 @ 25°CWeight: 3 gFeaturesScraper: YesGrease Cleaner: Yes..

General InformationModel: HYTE Solid Processor Frame - AM5 - Snow WhiteWarranty: 3 YearsCPU CompatibilityAMD AM5: Compatible with Ryzen 9000, 7000 series processorsIncluded ComponentsWrench: Included, L-ShapedScrews: Included for AMD AM5 compatibilityThermal Paste: Included, 2g HYTE Thermal GoopFeat..

General InformationModel: HYTE Solid Processor Frame Pitch BlackWarranty: 3 YearsCPU CompatibilityIntel LGA 1851: Compatible with Core Ultra 200S processorsIncluded ComponentsWrench: Included, L-ShapedThermal Paste: Included, 2g HYTE Thermal GoopFeaturesDesign: Universal mount designed for various C..

General InformationModel: HYTE Solid Processor Frame Pitch BlackWarranty: 3 YearsCPU CompatibilityIntel LGA 1851: Compatible with Core Ultra 200S processorsIncluded ComponentsWrench: Included, L-ShapedThermal Paste: Included, 2g HYTE Thermal GoopFeaturesDesign: Universal mount designed for various C..

General InformationProduct Name: HYTE Thermal Goop Thermal PasteQuantity: 2 gramsTube Size: 106 mm Length, 11 mm DiameterWarranty: 3 YearsTechnical SpecificationsThermal Conductivity: 6.3 W/mKElectrically Conductive: NoOperating Temperature Range: -40°C to 125°CDensity: 3.5 g/ccViscosity: 1,000 – 2,..

General InformationType: Solid thermal interface pad (non-adhesive)Use Case: Designed for CPU, GPU, memory modules, chipsets, and heatsink applicationsMaterial: High-quality silicone-based compound with thermally conductive fillersColor: GrayForm Factor: Pre-cut sheet for easy installationDimensions..

General InformationType: Solid thermal interface pad (non-adhesive, pre-cut)Use Case: Designed for CPU, GPU, VRM, M.2 SSDs, and other heat-generating componentsMaterial: High-quality silicone-based compound with thermally conductive fillersColor: GrayForm Factor: Pre-cut sheet for easy installationD..

General InformationType: CPU anti-bending backplate for Intel LGA1851 socketDesigned For: Preventing CPU bending or warping under pressure from heavy coolers (large air coolers, AIO liquid coolers)Material: High-quality anodized aluminum alloy with sandblasted finishColor: BlackForm Factor: Custom f..

General InformationModel: Socket Reinforcement Bracket for Intel LGA1700Color: BlackMaterial: High-quality anodized aluminum alloy with sandblasted finishPurpose: Prevents CPU socket bending or warping due to heavy coolers (large air coolers or AIO liquid coolers)Compatibility:CPUs: Intel 12th Gen (..

General InformationCompatibility:Designed for AMD AM5 motherboardsSupports Ryzen 7000-series processors and future AM5 CPUsPurpose:Replaces the stock backplate to allow installation of coolers that use M4 threaded screwsExpands compatibility beyond standard UNC 6-32 thread coolersUse Case:Ideal for ..