THERMALRIGHT

Model NameTL-M12Q X3BrandThermalrightCategoryARGB 120mm Heatsink / Case Fan (3-Pack Bundle)ColorBlack (Standard Frame and Blades) with ARGB LightingDesign & Build SpecificationsDimensions (Per Fan): 124 mm (L) × 120 mm (W) × 25 mm (H)Frame Material: High-quality PBT plastic frame for durability ..

Model NameTL-M12QRW X3BrandThermalrightCategoryARGB 120mm Heatsink / Case Fan (3-Pack Bundle)ColorWhite (Frame and Blades) with ARGB LightingDesign & Build SpecificationsDimensions (Per Fan): 124 mm (L) × 120 mm (W) × 25 mm (H)Frame Material: High-quality white PBT plastic frame for durability, ..

Model NameTL-M12QR X3BrandThermalrightCategoryARGB 120mm Heatsink / Case Fan (3-Pack Bundle)Design & Build SpecificationsDimensions (Per Fan): 124 mm (L) × 120 mm (W) × 25 mm (H)Frame Material: High-quality PBT plastic frame for durability and vibration dampeningBlade Design: Optimized aerodynam..

General SpecificationsProduct Type: 360mm AIO CPU CoolerCompatibility: Intel LGA115X / 1200 / 1700 / 1851 / 2011 / 2066 & AMD AM4 / AM5 SocketsWarranty: 5 YearsPumpDimensions: W66 mm x D66 mm x H63 mmRated Voltage: 12V DCConnector: 4 PIN PWMARGB Connector: 3 PIN 5VRadiatorDimensions: L397 mm x W..

General SpecificationsProduct Type: 360mm AIO CPU CoolerCompatibility: Intel & AMDWarranty: 3 YearsPumpDimensions: W69.2 mm x D69.2 mm x H53.5 mmRated Speed: 2800 RPM±10% (MAX)Rated Voltage: 12V DCConnector: 4 PIN PWMARGB Connector: 3 PIN 5VPump MTTF: 40000 HoursRadiatorDimensions: L397 mm x W12..

General SpecificationsProduct Type: 360mm AIO CPU CoolerCompatibility: Intel & AMDWarranty: 3 YearsPumpDimensions: W69.2 mm x D69.2 mm x H53.5 mmRated Speed: 2800 RPM±10% (MAX)Rated Voltage: 12V DCConnector: 4 PIN PWMARGB Connector: 3 PIN 5VPump MTTF: 40000 HoursRadiatorDimensions: L397 mm x W12..

General InformationType: Solid thermal interface pad (non-adhesive)Use Case: Designed for CPU, GPU, memory modules, chipsets, and heatsink applicationsMaterial: High-quality silicone-based compound with thermally conductive fillersColor: GrayForm Factor: Pre-cut sheet for easy installationDimensions..

General InformationType: Solid thermal interface pad (non-adhesive, pre-cut)Use Case: Designed for CPU, GPU, VRM, M.2 SSDs, and other heat-generating componentsMaterial: High-quality silicone-based compound with thermally conductive fillersColor: GrayForm Factor: Pre-cut sheet for easy installationD..

Thermal PerformanceThermal Conductivity: 12.8 W/m·K – ensures fast and efficient heat dissipationThermal Impedance: Less than 0.01 ℃·cm²/W – minimizes resistance for improved thermal contactTemperature Range: Stable operation from -150°C to +250°C – ideal for extreme environments including overclock..

General InformationType: Silicone-based thermal interface material (TIM)Color: GrayUse Case: Designed for efficient heat transfer between CPUs, GPUs, coolers, and heatsinksFormulation: Metal-free, non-conductive formula – safe for sensitive electronicsVolume: 8 grams per syringe – ideal for multiple..

General InformationType: CPU anti-bending backplate for Intel LGA1851 socketDesigned For: Preventing CPU bending or warping under pressure from heavy coolers (large air coolers, AIO liquid coolers)Material: High-quality anodized aluminum alloy with sandblasted finishColor: BlackForm Factor: Custom f..

General InformationModel: Socket Reinforcement Bracket for Intel LGA1700Color: BlackMaterial: High-quality anodized aluminum alloy with sandblasted finishPurpose: Prevents CPU socket bending or warping due to heavy coolers (large air coolers or AIO liquid coolers)Compatibility:CPUs: Intel 12th Gen (..