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Core specsThermal conductivity: 14.8 W/m·K as listed for TR50L.Quantity and format: 4 g syringe for PC and electronics use.Composition and color: Silicone‑based, gray compound.Electrical behavior: Non‑conductive and non‑corrosive per vendor description...

Thermal PerformanceThermal Conductivity: Extremely high – comparable to quality thermal pastesThermal Resistance: Very low – ensures minimal heat bottleneck between component and heatsinkCompliance & Compressibility: Outstanding mechanical compliance for uneven surfaces and tight mounting pressu..

General InformationType: Solid thermal interface pad (non-adhesive)Use Case: Designed for CPU, GPU, memory modules, chipsets, and heatsink applicationsMaterial: High-quality silicone-based compound with thermally conductive fillersColor: GrayForm Factor: Pre-cut sheet for easy installationDimensions..

General InformationType: Solid thermal interface pad (non-adhesive, pre-cut)Use Case: Designed for CPU, GPU, VRM, M.2 SSDs, and other heat-generating componentsMaterial: High-quality silicone-based compound with thermally conductive fillersColor: GrayForm Factor: Pre-cut sheet for easy installationD..

Thermal PerformanceThermal Conductivity: 12.8 W/m·K – ensures fast and efficient heat dissipationThermal Impedance: Less than 0.01 ℃·cm²/W – minimizes resistance for improved thermal contactTemperature Range: Stable operation from -150°C to +250°C – ideal for extreme environments including overclock..

General InformationType: Silicone-based thermal interface material (TIM)Color: GrayUse Case: Designed for efficient heat transfer between CPUs, GPUs, coolers, and heatsinksFormulation: Metal-free, non-conductive formula – safe for sensitive electronicsVolume: 8 grams per syringe – ideal for multiple..

Thermal PerformanceThermal Conductivity: 14 W/m·K – excellent heat transfer efficiencyThermal Impedance: <0.01 ℃·cm²/W – minimal resistance for improved cooling performanceUsable Temperature Range: -220°C to 380°C – suitable for extreme overclocking and industrial applicationsViscosity: Optimized..

Thermal PerformanceThermal Conductivity: 12.8 W/m·K – delivers excellent heat transfer efficiencyThermal Impedance: < 0.01 ℃·cm²/W – ensures minimal resistance for efficient coolingViscosity: Optimized for smooth, even application and full surface coverageTemperature Range: -150°C to 250°C – suit..