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Thermal PerformanceThermal Conductivity: Extremely high – comparable to quality thermal pastesThermal Resistance: Very low – ensures minimal heat bottleneck between component and heatsinkCompliance & Compressibility: Outstanding mechanical compliance for uneven surfaces and tight mounting pressu..

General InformationType: Solid thermal interface pad (non-adhesive)Use Case: Designed for CPU, GPU, memory modules, chipsets, and heatsink applicationsMaterial: High-quality silicone-based compound with thermally conductive fillersColor: GrayForm Factor: Pre-cut sheet for easy installationDimensions..

General InformationModel: Conductonaut Black EditionType: Pre-cut thermal padsQuantity: 4 pads per packDimensions: 120 mm x 20 mm x 3.0 mmColor: BlackMaterial Composition: Ceramic silicon formula complex with nano aluminum oxide for improved heat transferThermal Performance: Enhanced over Basic seri..

Core SpecificationsGraphic Engine: NVIDIA® GeForce RTX™ 5070AI Performance: 1026 TOPs, providing high AI computing capabilitiesBus Standard: PCI Express 5.0, supporting next-generation speedsCUDA® Cores: 6144, delivering strong parallel processingMemory and PerformanceVideo Memory: 12GB GDDR7, optim..

Core SpecificationsGraphic Engine: NVIDIA® GeForce RTX™ 5070AI Performance: 1005 TOPs, providing high AI processing capabilitiesBus Standard: PCI Express 5.0, ensuring next-generation compatibilityCUDA® Cores: 6144, delivering strong parallel computing powerMemory & PerformanceVideo Memory: 12GB..