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General InformationProduct Name: HYTE Thermal Goop Thermal PasteQuantity: 2 gramsTube Size: 106 mm Length, 11 mm DiameterWarranty: 3 YearsTechnical SpecificationsThermal Conductivity: 6.3 W/mKElectrically Conductive: NoOperating Temperature Range: -40°C to 125°CDensity: 3.5 g/ccViscosity: 1,000 – 2,..

General InformationType: Solid thermal interface pad (non-adhesive)Use Case: Designed for CPU, GPU, memory modules, chipsets, and heatsink applicationsMaterial: High-quality silicone-based compound with thermally conductive fillersColor: GrayForm Factor: Pre-cut sheet for easy installationDimensions..

General InformationType: Solid thermal interface pad (non-adhesive, pre-cut)Use Case: Designed for CPU, GPU, VRM, M.2 SSDs, and other heat-generating componentsMaterial: High-quality silicone-based compound with thermally conductive fillersColor: GrayForm Factor: Pre-cut sheet for easy installationD..

General InformationType: CPU anti-bending backplate for Intel LGA1851 socketDesigned For: Preventing CPU bending or warping under pressure from heavy coolers (large air coolers, AIO liquid coolers)Material: High-quality anodized aluminum alloy with sandblasted finishColor: BlackForm Factor: Custom f..

General InformationModel: Socket Reinforcement Bracket for Intel LGA1700Color: BlackMaterial: High-quality anodized aluminum alloy with sandblasted finishPurpose: Prevents CPU socket bending or warping due to heavy coolers (large air coolers or AIO liquid coolers)Compatibility:CPUs: Intel 12th Gen (..