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Model NameGIGABYTE B860M EAGLE WIFI6 V2 Micro ATX MotherboardBrandGIGABYTE / EAGLECPU & ChipsetCPU Socket: LGA1851Supported Processors: Intel® Core™ Ultra Processors (Series 2 / Arrow Lake-S)Chipset: Intel® B860 Express ChipsetMemoryMemory Type: DDR5Memory Slots: 4 × DDR5 DIMM sockets (Dual-chan..

Model NameRedragon Hades H838 V2 Gaming Wireless HeadsetBrandRedragonAudio & Sound PerformanceDrivers: 50mm Dynamic DriversFrequency Response: 20 Hz – 20,000 HzSensitivity: 118 dBSurround Sound: 7.1 Virtual Surround Sound for immersive spatial audioDesign: Over-Ear, Closed-Back for enhanced soun..

Motherboard SupportATXMicro ATXMini-ITXCase MaterialSPCC 0.6mmDimensionsNot specifiedCompatibility & ClearanceMax GPU Clearance: 310 mmPCIe Slots: 7Max CPU Cooler Height: 167 mmMax PSU Length: 200 mm (bottom-mounted)Drive BaysHDD: 2 or 1SSD: 3 or 2Fan SupportFront: 120mm × 3 / 140mm × 2Rear: 120..

Pump & Water BlockWater Block Dimensions: 78.5 × 70 × 54 mmPump Speed: 2700 ±10% RPM (high-flow for efficient heat transfer)Power Consumption:Voltage: 12VStart Voltage: 6VCurrent: 0.35ATotal Power: 4.2WTubing Length: 450 mm (flexible, reinforced rubber with black sleeving)RadiatorDimensions: 394..

NVIDIA GeForce RTX 3050 Graphics CardModel: GeForce RTX 3050Form Factor: ATXWarranty: Typically 3 years (varies by region)Core SpecificationsGPU Architecture: AmpereCUDA Cores: 2,304Core Clock: 1,477 MHz (Reference: 1,470 MHz)Memory Clock: 14,000 MHzMemory Size: 6 GB GDDR6Memory Bus: 96-bitCard Bus:..

General InformationType: Solid thermal interface pad (non-adhesive)Use Case: Designed for CPU, GPU, memory modules, chipsets, and heatsink applicationsMaterial: High-quality silicone-based compound with thermally conductive fillersColor: GrayForm Factor: Pre-cut sheet for easy installationDimensions..

General InformationType: Solid thermal interface pad (non-adhesive, pre-cut)Use Case: Designed for CPU, GPU, VRM, M.2 SSDs, and other heat-generating componentsMaterial: High-quality silicone-based compound with thermally conductive fillersColor: GrayForm Factor: Pre-cut sheet for easy installationD..

General InformationModel: Socket Reinforcement Bracket for Intel LGA1700Color: BlackMaterial: High-quality anodized aluminum alloy with sandblasted finishPurpose: Prevents CPU socket bending or warping due to heavy coolers (large air coolers or AIO liquid coolers)Compatibility:CPUs: Intel 12th Gen (..

General InformationType: All-in-One (AIO) liquid CPU coolerForm Factor: 360mm radiator for high-performance coolingColor: White with customizable RGB lightingDesigned For: High-end Intel and AMD CPUsKey Features:2.7” IPS LCD Display on Pump Block3 x TL-K12W PWM ARGB FansWhite Aluminum Radiator + Cop..

Water BlockDimensions: 89 x 92 x 108 mmBlock Material (CPU Plate): CopperEmbedded Fan: YesSpeed: 5100 RPM ± 10%Air Pressure: 5.53 mmH2OAir Flow: 21.08 CFMRadiatorDimensions: 399.5 x 120 x 30 mmMaterial: AluminumTube: Sleeved Rubber TubeTube Length: 400 mmFanFan Type: ROG Magnetic Daisy-chainable Fan..

Water BlockDimensions: 89 x 92 x 108 mmBlock Material (CPU Plate): CopperEmbedded Fan: YesSpeed: 5100 RPM ± 10%Air Pressure: 5.53 mmH2OAir Flow: 21.08 CFMRadiatorDimensions: 399.5 x 120 x 30 mmMaterial: AluminumTube: Sleeved Rubber TubeTube Length: 400 mmFanFan Type: ROG Magnetic Daisy-chainable Fan..

Case Form FactorType: Mid TowerMotherboard TypeSupport: Mini ITX / Micro ATX / ATX / CEB / E-ATXDimensionsWidth x Height x Depth (mm): 268 x 530 x 512 mmWidth x Height x Depth (in): 10.6 x 20.9 x 20.2 inI/O PanelType C Gen 2: 1 portUSB 3.0: 2 ports4 Pole Headset Audio Jack: 1Reset Button: 1Drive Bay..