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General InformationType: Solid thermal interface pad (non-adhesive)Use Case: Designed for CPU, GPU, memory modules, chipsets, and heatsink applicationsMaterial: High-quality silicone-based compound with thermally conductive fillersColor: GrayForm Factor: Pre-cut sheet for easy installationDimensions..

General InformationType: Solid thermal interface pad (non-adhesive, pre-cut)Use Case: Designed for CPU, GPU, VRM, M.2 SSDs, and other heat-generating componentsMaterial: High-quality silicone-based compound with thermally conductive fillersColor: GrayForm Factor: Pre-cut sheet for easy installationD..

Thermal PerformanceThermal Conductivity: 12.8 W/m·K – ensures fast and efficient heat dissipationThermal Impedance: Less than 0.01 ℃·cm²/W – minimizes resistance for improved thermal contactTemperature Range: Stable operation from -150°C to +250°C – ideal for extreme environments including overclock..

General InformationType: Silicone-based thermal interface material (TIM)Color: GrayUse Case: Designed for efficient heat transfer between CPUs, GPUs, coolers, and heatsinksFormulation: Metal-free, non-conductive formula – safe for sensitive electronicsVolume: 8 grams per syringe – ideal for multiple..

General InformationType: High-performance dual-tower air coolerDesign: Optimized for high airflow , low noise , and broad socket compatibilityUse Case: Ideal for gaming, overclocking, and workstation builds on modern Intel and AMD platformsWarranty: Not explicitly stated (typically 5–6 years for The..

General InformationType: High-performance dual-tower air coolerDesign: Optimized for high airflow , low noise , and broad socket compatibilityUse Case: Ideal for gaming, overclocking, and workstation builds on modern Intel and AMD platformsWarranty: Not explicitly stated (typically 5–6 years for The..

Thermal PerformanceThermal Conductivity: 14 W/m·K – excellent heat transfer efficiencyThermal Impedance: <0.01 ℃·cm²/W – minimal resistance for improved cooling performanceUsable Temperature Range: -220°C to 380°C – suitable for extreme overclocking and industrial applicationsViscosity: Optimized..

Heatsink DesignDimensions : 120 mm (L) x 46 mm (W) x 148 mm (H)Weight (heatsink only) : 630 gHeatpipes : 4 x 6 mm copper heatpipesAGHP Technology : Anti-Gravity Heat Pipe ensures consistent thermal performance regardless of orientationBaseplate : C1100 pure copper base with nickel platingCooling Per..

Cooling PerformanceCooling solution: All-in-One liquid cooler with 360mm radiatorTDP support: Up to 320WPump: High-performance dual-chamber pump with non-conductive coolant, advanced three-phase motor for reduced vibration and quieter operationPump speed: Approximately 2700 RPMRadiator dimensions: 3..

Cooling PerformanceCooling solution: All-in-One liquid cooler with 360mm radiatorTDP support: Up to 320WPump: High-performance dual-chamber pump with non-conductive coolant, advanced three-phase motor for reduced vibration and quieter operationPump speed: Approximately 2700 RPMRadiator dimensions: 3..

RadiatorRadiator Dimensions: 397 x 120 x 27 mmRadiator Material: AluminumTDP Number: Vortex360 280WPumpDimensions: Ø67 x 48.5 mmRating Voltage: DC 12 VMinimum Startup Voltage: ≥ 5.0 VFan Speed: 2800 ± 10% RPMRated Current: 0.25 ± 20% AConsumed Power: 3.0 WFlow Rate: ≥ 1300 mL/minWater Pressure: 1.4M..

Package ContentsAir CoolerPWM 120 mm Fan: 1Single Heatsink with 4 Heatpipes: 1Thermal Grease: 1Universal Socket Mounting KitsAir Cooler - FanFan Dimensions120 x 120 x 25 mmFin MaterialAluminumFan Speed800-1800 RPM ±10%Air Flow72.94 CFMAir Pressure2.63 mmH2ONoise Level10-32 dBABearingHydraulicAir Coo..