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Thermalright Heilos 40x60x0.25mm V2 Thermal Interface Pad — 8.5 W/mK Thermal Conductivity, 0.25mm Thickness, Gray Non-Conductive Silicone Sheet, Low Thermal Resistance 0.04 °C·cm²/W, High Resistivity 2.1×10¹⁴ Ω·cm, Compatible with CPU Coolers

Thermalright Heilos 40x60x0.25mm V2 Thermal Interface Pad — 8.5 W/mK Thermal Conductivity, 0.25mm Thickness, Gray Non-Conductive Silicone Sheet, Low Thermal Resistance 0.04 °C·cm²/W, High Resistivity 2.1×10¹⁴ Ω·cm, Compatible with CPU Coolers
Thermalright Heilos 40x60x0.25mm V2 Thermal Interface Pad — 8.5 W/mK Thermal Conductivity, 0.25mm Thickness, Gray Non-Conductive Silicone Sheet, Low Thermal Resistance 0.04 °C·cm²/W, High Resistivity 2.1×10¹⁴ Ω·cm, Compatible with CPU Coolers
Thermalright Heilos 40x60x0.25mm V2 Thermal Interface Pad — 8.5 W/mK Thermal Conductivity, 0.25mm Thickness, Gray Non-Conductive Silicone Sheet, Low Thermal Resistance 0.04 °C·cm²/W, High Resistivity 2.1×10¹⁴ Ω·cm, Compatible with CPU Coolers
Thermalright Heilos 40x60x0.25mm V2 Thermal Interface Pad — 8.5 W/mK Thermal Conductivity, 0.25mm Thickness, Gray Non-Conductive Silicone Sheet, Low Thermal Resistance 0.04 °C·cm²/W, High Resistivity 2.1×10¹⁴ Ω·cm, Compatible with CPU Coolers
Thermalright Heilos 40x60x0.25mm V2 Thermal Interface Pad — 8.5 W/mK Thermal Conductivity, 0.25mm Thickness, Gray Non-Conductive Silicone Sheet, Low Thermal Resistance 0.04 °C·cm²/W, High Resistivity 2.1×10¹⁴ Ω·cm, Compatible with CPU Coolers
Thermalright Heilos 40x60x0.25mm V2 Thermal Interface Pad — 8.5 W/mK Thermal Conductivity, 0.25mm Thickness, Gray Non-Conductive Silicone Sheet, Low Thermal Resistance 0.04 °C·cm²/W, High Resistivity 2.1×10¹⁴ Ω·cm, Compatible with CPU Coolers
Thermalright Heilos 40x60x0.25mm V2 Thermal Interface Pad — 8.5 W/mK Thermal Conductivity, 0.25mm Thickness, Gray Non-Conductive Silicone Sheet, Low Thermal Resistance 0.04 °C·cm²/W, High Resistivity 2.1×10¹⁴ Ω·cm, Compatible with CPU Coolers
Thermalright Heilos 40x60x0.25mm V2 Thermal Interface Pad — 8.5 W/mK Thermal Conductivity, 0.25mm Thickness, Gray Non-Conductive Silicone Sheet, Low Thermal Resistance 0.04 °C·cm²/W, High Resistivity 2.1×10¹⁴ Ω·cm, Compatible with CPU Coolers
Thermalright Heilos 40x60x0.25mm V2 Thermal Interface Pad — 8.5 W/mK Thermal Conductivity, 0.25mm Thickness, Gray Non-Conductive Silicone Sheet, Low Thermal Resistance 0.04 °C·cm²/W, High Resistivity 2.1×10¹⁴ Ω·cm, Compatible with CPU Coolers
Thermalright Heilos 40x60x0.25mm V2 Thermal Interface Pad — 8.5 W/mK Thermal Conductivity, 0.25mm Thickness, Gray Non-Conductive Silicone Sheet, Low Thermal Resistance 0.04 °C·cm²/W, High Resistivity 2.1×10¹⁴ Ω·cm, Compatible with CPU Coolers
Thermalright Heilos 40x60x0.25mm V2 Thermal Interface Pad — 8.5 W/mK Thermal Conductivity, 0.25mm Thickness, Gray Non-Conductive Silicone Sheet, Low Thermal Resistance 0.04 °C·cm²/W, High Resistivity 2.1×10¹⁴ Ω·cm, Compatible with CPU Coolers
999 EGP
Ex Tax: 999 EGP
  • Stock: In Stock
  • Model: Heilos Solid Thermal Interface Sheet V2 40x60mm

General Information

  • Type: Solid thermal interface pad (non-adhesive, pre-cut)
  • Use Case: Designed for CPU, GPU, VRM, M.2 SSDs, and other heat-generating components
  • Material: High-quality silicone-based compound with thermally conductive fillers
  • Color: Gray
  • Form Factor: Pre-cut sheet for easy installation
  • Dimensions:
    • Length: 40 mm
    • Width: 60 mm
    • Thickness: 0.25 mm

Thermal Performance

  • Thermal Conductivity: 8.5 W/m·K – delivers efficient heat transfer for modern processors
  • Thermal Resistance: 0.04 °C·cm²/W – ensures minimal thermal bottleneck between component and heatsink
  • Application: Ideal for use with air coolers, AIO liquid coolers, and passive cooling systems
  • Temperature Stability: Operates reliably across standard PC thermal ranges
  • Durability: Long-lasting performance without drying out or requiring reapplication

Electrical & Safety Features

  • Electrical Resistivity: 2.1 × 10¹⁴ Ω·cm – highly non-conductive
  • Electrical Isolation: Yes – safe for use on sensitive electronics without risk of short circuits
  • Corrosion Resistance: Non-corrosive formula – protects PCB and surrounding components
  • Handling Safety: Harmless to skin and components – no toxic or reactive materials used

Design & Application

  • Material Type: Solid-phase thermal pad (not paste-based) – ideal for gap filling and even pressure distribution
  • Installation Method: Drop-in replacement or supplementary to thermal paste
  • Mounting Pressure: Works best under moderate pressure from cooler mounting systems
  • Use With:
    • Stock or aftermarket CPU/GPU coolers
    • Memory modules with direct-contact heatsinks
    • M.2 SSDs and VRMs