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999 EGP
Ex Tax: 999 EGP
- Stock: In Stock
 - Model: Heilos Solid Thermal Interface Sheet V2 40x60mm
 
Tags:
Thermalright Heilos V2
,                              thermal interface pad 40x60x0.25mm
,                              8.5 W/mK thermal conductivity
,                              non-conductive silicone pad
,                              CPU cooler thermal pad
,                              low thermal resistance
,                              0.25mm thickness thermal pad
,                              high resistivity thermal pad
,                              gray thermal pad
,                              safe thermal interface material
,                              efficient heat transfer
,                              PC cooling accessory
General Information
- Type: Solid thermal interface pad (non-adhesive, pre-cut)
 - Use Case: Designed for CPU, GPU, VRM, M.2 SSDs, and other heat-generating components
 - Material: High-quality silicone-based compound with thermally conductive fillers
 - Color: Gray
 - Form Factor: Pre-cut sheet for easy installation
 - Dimensions:
- Length: 40 mm
 - Width: 60 mm
 - Thickness: 0.25 mm
 
 
Thermal Performance
- Thermal Conductivity: 8.5 W/m·K – delivers efficient heat transfer for modern processors
 - Thermal Resistance: 0.04 °C·cm²/W – ensures minimal thermal bottleneck between component and heatsink
 - Application: Ideal for use with air coolers, AIO liquid coolers, and passive cooling systems
 - Temperature Stability: Operates reliably across standard PC thermal ranges
 - Durability: Long-lasting performance without drying out or requiring reapplication
 
Electrical & Safety Features
- Electrical Resistivity: 2.1 × 10¹⁴ Ω·cm – highly non-conductive
 - Electrical Isolation: Yes – safe for use on sensitive electronics without risk of short circuits
 - Corrosion Resistance: Non-corrosive formula – protects PCB and surrounding components
 - Handling Safety: Harmless to skin and components – no toxic or reactive materials used
 
Design & Application
- Material Type: Solid-phase thermal pad (not paste-based) – ideal for gap filling and even pressure distribution
 - Installation Method: Drop-in replacement or supplementary to thermal paste
 - Mounting Pressure: Works best under moderate pressure from cooler mounting systems
 - Use With:
- Stock or aftermarket CPU/GPU coolers
 - Memory modules with direct-contact heatsinks
 - M.2 SSDs and VRMs
 
 















