





Thermalright LGA1700-BCF Black V2 CPU Anti-Bend Backplate — Aluminum Alloy, 54x70x6mm, 20g, Includes L-Shaped Screwdriver, Compatible with Intel 12th/13th/14th Gen LGA1700 CPUs, Enhances Cooling Stability and Prevents CPU Bending, Black Finish
499 EGP
Ex Tax: 499 EGP
- Stock: In Stock
- Model: LGA1700-BCF BLACK V2
Tags:
Thermalright LGA1700-BCF Black V2
, CPU anti-bend backplate
, Intel LGA1700 backplate
, 12th Gen Intel CPU accessory
, 13th Gen Intel CPU accessory
, 14th Gen Intel CPU accessory
, aluminum alloy backplate
, black anodized backplate
, CPU cooler support
, prevents CPU bending
, cooling stability
, heat dissipation improvement
, L-shaped screwdriver included
, easy installation
, compatible with air and liquid coolers
, 54x70x6mm
, 20g weight
, Thermalright CPU accessory
, high-performance PC cooling
General Information
- Model: Socket Reinforcement Bracket for Intel LGA1700
- Color: Black
- Material: High-quality anodized aluminum alloy with sandblasted finish
- Purpose: Prevents CPU socket bending or warping due to heavy coolers (large air coolers or AIO liquid coolers)
- Compatibility:
- CPUs: Intel 12th Gen (Alder Lake), 13th Gen (Raptor Lake), and 14th Gen (Meteor Lake)
- Chipsets: H610, B660, B760, Z690, Z790, and other compatible LGA1700 motherboards
Physical Design
- Dimensions: 54 x 70 x 6 mm
- Weight:
- Main body: ~20g
- Total weight (with accessories): ~55g
- Finish: Anodized black aluminum with precision CNC machining
- Installation: Tool-free or screw-based depending on model; designed to fit without interfering with capacitors or VRM components
Included Accessories
- L-shaped screwdriver for easy installation in tight spaces
- Thermalright TF7 thermal paste (2g syringe) – for improved thermal conductivity during cooler installation